| 摘要 |
PROBLEM TO BE SOLVED: To provide an improved method for packaging an integrated circuit in a multichip module. SOLUTION: The method according to the present invention consists of a step for coupling a first integrated circuit die to a substrate, a step for encapsulating the first integrated circuit die, a step for conducting a test on the first integrated circuit die and a step for coupling a second integrated circuit die to the substrate, when the test of the first integrated circuit die is successful. |
