| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a lead frame island structure which is capable of protecting a semiconductor chip mounted on an island against damage caused by warpage or twists that occur in the island due to the fact that a molding resin is shrunk when it is solidified in an electronic part process where a semiconductor chip is mounted on an island, electrically connected to leads, and sealed up with molding resin. SOLUTION: The peripheral edges of an island 1 are folded up to serve as ribs 9. Or, a semiconductor chip housing recess 10 is provided to the island 1, by which a reinforcing wall 11 is formed. Or, a reinforcing plate 13 is provided to the rear of the island.</p> |
