| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring board by which a tapered via hole is obtained easily, without changing a composition for improving light transmittance of an insulating resin. SOLUTION: In this method of manufacturing the wiring board, a part except where a hole is provided of an insulating layer using a photocuring resin is exposed, and then a part not exposed is developed and removed to form a hole, and treatment is performed using liquid solution with which the developing solution has been diluted, after development. |
