| 摘要 |
<p>PROBLEM TO BE SOLVED: To realize a method of manufacturing a composite lead frame where a plate such as a heat dissipating plate mounted with a semiconductor element and inner leads are joined together. SOLUTION: A lead frame where a connector which connects the tips of inner leads 10 together is provided is formed, a tape-like member 22 is pasted on the joint surface of the lead frame with a plate 14, which is used as the heat dissipating plate of the inner leads, along the connector separating from it by a certain distance, the connector is removed in such a state where the tape-like member 22 is kept pasted, then a tape-like adhesive member 30 is provided on the joint surface of the plate 14 with the inner leads 10 so as to be located between the tape-like member and the tips of the inner leads and along the tape-like member 22, and the inner leads 10 where the tape-like member is pasted are superposed on the plate 14 through the intermediary of the tape-like adhesive member 30 and bonded together by heating.</p> |
