INTEGRATED PACKAGING OF MICROMECHANICAL SENSORS AND CONTROL CIRCUITS

摘要

A micromechanical sensor (42) is fabricated on a first semiconductor wafer (40), and a control circuit is fabricated on a front side of a second wafer (30). A cavity (36) is formed on the backside of the second wafer, the cavit y is being formed such that the sensor on the wafer fits within the cavity whe n the wafers are brought together in an adjoining relationship. Through-holes (34) are etched through the backside of the second wafer to allow access to electrical points and a patterned layer (38) is deposited to form electrical interconnections between electrical contact points and terminal points on th e backside of the wafer via through-holes. The two wafers are cleaned and bond ed together. The bonded wafers are diced to yield individual bonded sensor- control circuit pairs.