| 摘要 |
PROBLEM TO BE SOLVED: To provide a fitting structure for heat radiator of low cost, in which adverse influence exerted upon an electronic component fitted to a main body of an electronic apparatus by conducting heat of a heat radiator to the main body is prevented. SOLUTION: The main body of an electronic apparatus containing a lower chassis and an upper chassis 12, in which a part or the whole consists of a thin metal plate material is provided, and a printed board 1 housed in the main body and a power IC 2 that is mounted on a surface of the printed board 1, are contained. A heat radiator 20 that releases heat generated from the power IC 2 by fixing to a contact surface 12a of the upper chassis 12 consisting of metal plate material and bringing into surface-contact with the power IC 2 is provided. Furthermore, a plurality of protrusions 12d are provided to the contact surface 12a of the upper chassis 12 to fix the heat radiator 20 to the upper chassis 12 under a condition of providing an interval C by bringing the radiator 20 into point-contact with the upper chassis 12, so that the heat transmitted to the upper chassis 12 via the heat radiator 20 that is generated from the power IC 2 is decreased. |
