发明名称 |
Microelectronic components with frangible lead sections |
摘要 |
Flexible leads for making electrical connection in microelectronic components include a frangible intermediate section. The frangible intermediate section is formed by a region within the lead having weakened mechanical integrity. The frangible intermediate section is made by providing a sacrificial metal layer and forming a projection on the surface of the metal layer from a portion thereof. Lead forming material is deposited onto the surface of the sacrificial metal layer and over the projection. A dielectric layer is formed on the surface of the lead forming material. Upon removing the sacrificial metal layer, a frangible intermediate section is formed within the lead forming material at the location of the projection.
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申请公布号 |
US6218213(B1) |
申请公布日期 |
2001.04.17 |
申请号 |
US19990325262 |
申请日期 |
1999.06.03 |
申请人 |
TESSERA, INC. |
发明人 |
FJELSTAD JOSEPH;SMITH JOHN W. |
分类号 |
H01L21/48;H01L23/495;(IPC1-7):H01L21/44;H01L21/50 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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