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经营范围
发明名称
CHIP SCALE PACKAGE USING LARGE DUCTILE SOLDER BALLS
摘要
申请公布号
KR20010031276(A)
申请公布日期
2001.04.16
申请号
KR1020007004263
申请日期
2000.04.20
申请人
发明人
分类号
H01L23/48
主分类号
H01L23/48
代理机构
代理人
主权项
地址
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