发明名称 |
Device for holding microstructure to be heated has connecting arrangement between plate and frame with bridge body(ies) with bearer frame, bearer plate, intermediate connecting sections |
摘要 |
The device has a bearer plate (1) on which the microstructure is mounted and that is enclosed by a bearer frame (5) at a distance and a connecting arrangement connecting the plate and frame with at least one bridge body (13,14) with bearer frame, bearer plate and intermediate insulation holder connecting sections. The bridge body material has lower thermal conductivity than the bearer plate and bearer frame. Independent claims are also included for the following: a method of manufacturing a device for holding a microstructure to be heated.
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申请公布号 |
DE19944410(A1) |
申请公布日期 |
2001.04.12 |
申请号 |
DE19991044410 |
申请日期 |
1999.09.16 |
申请人 |
FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.;CONSEJO SUPERIOR DE INVESTIGACIONES CIENTIFICAS, MADRID |
发明人 |
BOETTNER, HARALD;SEIBERT, KLAUS;CANE, CARLES;GOETZ, ANDREAS |
分类号 |
G01N27/12;(IPC1-7):G01N27/00;G01N27/04 |
主分类号 |
G01N27/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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