| 发明名称 |
ELECTRODE FOR SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD |
| 摘要 |
<p>An electrode for a semiconductor device superior in die-bonding and wire-bonding characteristics with a submount and its manufacturing method are provided. The electrode is formed by ohmic-contacting the surface of a semiconductor, which comprises a substrate electrode E1 having a layer structure formed on the surface of the semiconductor and a surface electrode E2 formed by covering the surface and/or side face of the substrate electrode E1. The surface electrode is manufactured by a vacuum evaporation system or sputtering system provided with a holder which is tilted with respect to a material of the surface electrode and able to rotate on its axis and orbit the material. <IMAGE></p> |
| 申请公布号 |
EP1091393(A1) |
申请公布日期 |
2001.04.11 |
| 申请号 |
EP20000903995 |
申请日期 |
2000.02.17 |
| 申请人 |
THE FURUKAWA ELECTRIC CO., LTD. |
发明人 |
TOYOSAKI, KOICHI;NAKAJIMA, AKIFUMI;TSUKIJI, NAOKI |
| 分类号 |
H01L21/285;H01L29/45;H01S5/042;(IPC1-7):H01L21/28;H01L29/43 |
主分类号 |
H01L21/285 |
| 代理机构 |
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| 主权项 |
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