SOLDER BONDED ELECTRONIC MODULE,申请号EP19970939598-传众专利搜索

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发明名称	SOLDER BONDED ELECTRONIC MODULE
摘要
申请公布号	EP0890297(A4)	申请公布日期	2001.04.11
申请号	EP19970939598	申请日期	1997.08.27
申请人	MOTOROLA, INC.	发明人	HUNNINGHAUS, ROY, E.;ANDREWS, KEVIN, M.;CHRISTOPHER, GARY, L.;ANDERSON, DAVID, J.;TOMASE, JOSEPH, P.
分类号	H01L25/10;H01L25/18;H05K1/02;H05K3/34;H05K3/42;H05K7/20;(IPC1-7):H05K1/00;H01L23/34	主分类号	H01L25/10
代理机构		代理人
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