| 摘要 |
PROBLEM TO BE SOLVED: To obtain a high-density mounting type semiconductor device, in which impedances are made almost identical. SOLUTION: This semiconductor device is provided with a plurality of conductive metal plates 12, 51, etc., which are formed on a semiconductor substrate 11 having electrodes 16, 22, a plurality of semiconductor chips 18a, 18b, 19a, 19b which are connected with the metal plates 12, 51, etc., and impedance equalizing means 52a, 52b which make the lengths of current paths formed between the chips 18a, 18b, etc., and the metal plates 12, 15, etc., nearly identical. Thereby the impedances of the semiconductor chips 18a, 18b, etc., and the electrodes 16, 22 are balanced, so that a high-density mounting type semiconductor device which does not generate oscillations can be obtained. |
