发明名称 WORK PRESS FOR TESTING SEMICONDUCTOR PACKAGE
摘要 PURPOSE: A work press for testing a semiconductor package is provided to improve a contact characteristic of a contact pin of a socket and the semiconductor package and to prevent a contactor of the work press from being damaged. CONSTITUTION: A work press(1) for testing a semiconductor package has a connecting table(2) for connection with a handler. A contactor holder(3) is coupled to the connecting table. A contactor(4) is coupled to a lower surface of an end portion of the contact holder. The contactor is fixed by a fixing pin(6) penetrating both sides of the contactor holder while the contactor is inserted into a groove(5) formed the lower surface of the end portion of the contactor holder.
申请公布号 KR20010027092(A) 申请公布日期 2001.04.06
申请号 KR19990038673 申请日期 1999.09.10
申请人 HYUNDAI MICRO ELECTRONICS CO., LTD. 发明人 LIM, YU SIK
分类号 H01L21/66;(IPC1-7):H01L21/66 主分类号 H01L21/66
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