METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method and an inspecting method of a semiconductor device and jigs thereof whereby the inspection of LSI chips being cut and separated can be made efficiently. SOLUTION: After cutting a semiconductor wafer into many semiconductor devices, they are inspected in a step using an integrating jig which is made of a material having a linear expansion coefficient near that of the semiconductor device and has housings for rearranging a specified number N of cut and separated semiconductor devices, thereby rearranging them into a unified block of the specified number N of semiconductor devices, and specified inspection processes are made in following inspecting steps. Thus the efficiency in the inspection is improved and the inspecting cost is reduced.