发明名称 ELECTRONIC EQUIPMENT
摘要 <p>PROBLEM TO BE SOLVED: To solve such a problem of a jet duct structure in which cooling air is reparately supplied to a plurality of heat generating devices mounted on a substrate in series or in parallel, that the amount of cooling air to the heat generating devices can not be equally distributed and larger amount of cooling air is supplied to the downstream heat generating devices, and the position of the heat generators and heat generation distribution matching the speed of distribution of the cooling air jet from holes is not considered at all. SOLUTION: Partitions having a some degree of height and width downstream of jet holes for cooling heal generators of a jet duct part are provided partition boards are placed in the central upper part of semiconductor devices mounted in parallel with the direction of flow, the area of opening of the jet holes for cooling the heat generators is made smaller in the downstream of the cooling air, and steps are provided in a stair form as advancing to the downstream side of the cooling air, or the parts where high-temperature heat is generated inside the semiconductors of jet duct are placed downstream of the cooling air.</p>
申请公布号 JP2001094283(A) 申请公布日期 2001.04.06
申请号 JP19990265013 申请日期 1999.09.20
申请人 HITACHI LTD 发明人 KONDO YOSHIHIRO;OHASHI SHIGEO;OGURO TAKAHIRO;SHIN TAKAYUKI
分类号 G06F1/20;H05K7/20;(IPC1-7):H05K7/20 主分类号 G06F1/20
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