An epoxy-resin composition and use thereof

摘要

An epoxy-resin composition comprising (A) an at least bifunctional epoxy compound and/or an at least bifunctional epoxy resin, (B) a curing agent, and (C) an accelerating agent, the accelerating agent essentially containing a phosphine oxide represented by general formula (1); where R1 to R6 all of which may be the same or not are hydrogen, straight, branched or cyclic alkyl having 1 to 10 carbons or aryl or aralkyl having 6 to 10 carbons. The epoxy-resin composition can be used for sealing a semiconductor integrated circuit in the manufacture of a semiconductor device.