| 摘要 |
PROBLEM TO BE SOLVED: To form a dense film at low temperature and prevent penetration of moisture, oxygen, or the like from the outside by forming a protecting film by ECR plasma sputtering method. SOLUTION: A protecting film 7 is formed by ECR plasma sputtering method. An organic EL element is composed of a substrate 1, an anode 2, an organic thin film layer 3, a hole transport layer 4, a light-emitting layer 5, a cathode 6, and the protecting film 7. Penetration of hydrogen, oxygen, or the like from the outside is prevented without breaking the EL element including the cathode 6 and others. Preferably, the organic EL element has a pair of electrodes and at least one organic thin film layer interposed between them, and the protecting film for protecting at least part of the outer surface. An electronic device whose part of the outer surface is protected with silicon nitride-oxide SiON has a pair of electrodes arranged on the substrate and at least one organic thin layer interposed between the electrodes.
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