| 摘要 |
<p>The present invention is directed to a moisture resistant, thermally conductive material (16) comprising a particulate filler comprising thermally conductive particles having a hydrophobic compound coating and a binder effective to join together the filler particles. The present invention also includes an electronic apparatus comprising a heat source (12), a heat sink (14), and a layer (16) of the moisture resistant, thermally conductive interface material disposed between and in contact with the heat source (12) and the heat sink (14). Still, the present invention is directed to a moisture resistant, thermally conductive material comprising particles of agglomerated boron nitride having a hydrophobic compound coating. Yet, the present invention includes a method of removing heat from a heat source comprising providing a heat sink proximate the heat source and disposing a layer of the moisture resistant, thermally conductive material between and in contact with the heat source and the heat sink.</p> |
