| 摘要 |
PROBLEM TO BE SOLVED: To prevent a carrier error of a substrate at the time of supporting the substrate on a support plate. SOLUTION: This substrate support head 8 is furnished with a housing 9, a base 10 connected to this housing 9, a holding ring 17 fixed on an outer peripheral part of this base 10 and a disc type support plate 20 arranged on the inside of this holding ring 17. A projected part 24 for supporting of a ring shape is provided on a peripheral edge part of a lower surface of the support plate 20. This projected part 24 for supporting is formed from a peripheral edge of the support plate 20 to a position corresponding to an outside side surface forming a ring groove 22. An edge part of a wafer W including an orientation flat part is held through a flexible film 25 on the projected part 24 for supporting along an overall periphery in the case of supporting the wafer W having the orientation flat on the support plate 20. |
