| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminated carrier board, where its manufacturing cost can be reduced, productivity improved, and mother board mode small in size for preparation. SOLUTION: This laminated carrier board 9 is interposed between a mother board 5 having a plurality of board terminals and an integrated circuit 1 having a plurality of input/output terminals 6 for making electrical connection between the board terminals to the terminals 6. The board 9 is constructed by laminating a plurality of carrier boards 22. Each board 22 has a through hole 14 formed to penetrate both of its surfaces, and a circuit pattern is provided on at least one of its surfaces. Capacitors are formed on the uppermost board 22'.
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