| 摘要 |
Memory chips (2a,2b) are pressed into an opening formed in an upper and a lower circuit board. The data bus for all memory chips is independent, while address and control bus is connected in parallel. The memory chips are packaged in one package to increase the storage capacity. Two memory chips can be arranged beside each other in the opening, to double the storage capacity. The chips may be stuck together using double-sided sticky tape.
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