发明名称 Semiconductor device having sealing film formed on the surface having columnar electrodes thereon and method of manufacturing the same
摘要 <p>A sealing film (18) is formed by a screen printing method. In this case, the temperature of the printing table (13) is set at about 30 to 50 DEG C by the heat generation from a planar heater (16) arranged within the printing table (13). A liquid sealing resin having a relatively high viscosity of about 500,000 to 1,500,000 cPS is used for forming the sealing film (18). However, the liquid sealing film is warmed by the printing table (13) to about 30 to 50 DEG C. As a result, the viscosity of the liquid sealing resin is lowered to about 50,000 to 200,000 cPS. After the curing, the viscosity of the sealing film (18) is brought back to the original value of about 500,000 to 1,500,000 cPS. <IMAGE></p>
申请公布号 EP1085565(A2) 申请公布日期 2001.03.21
申请号 EP20000116963 申请日期 2000.08.07
申请人 CASIO COMPUTER CO., LTD. 发明人 OSAMU, KUWABARA
分类号 H01L23/12;H01L21/56;H01L21/60;H01L23/492;(IPC1-7):H01L21/56 主分类号 H01L23/12
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