发明名称 |
Use of a cleaning process, a cleaning process, a connection process and a workpiece pair |
摘要 |
A method uses a treatment process for surfaces which subsequently are to be connected by bonding, gluing or molding. The surfaces are exposed to an atmosphere with activated hydrogen. The connection is made a process step for eliminating the conservation treatment. The surfaces can be subjected to a plasma discharge in an atmosphere containing hydrogen. The plasma discharge is operated by a cathode/anode path as a DC discharge, and using a thermionic cathode as the cathode. The workpiece to be stored in air comprises a connection, which by gluing, bonding or molding, is subjectable to substantially higher stress than an identical workpiece which is stored in an identical manner, this being determinable by essentially identical Auger diagrams.
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申请公布号 |
US6203637(B1) |
申请公布日期 |
2001.03.20 |
申请号 |
US19980172598 |
申请日期 |
1998.10.15 |
申请人 |
UNAXIS BALZERS AKTIENGESELLSCHAFT |
发明人 |
DOMMANN ALEX;LUECHINGER-BAUTISTA CHRISTOPH BENNO;ONDA NICOLINO;RAMM JUERGEN;ZIMMERMAN HEINRICH |
分类号 |
H05H1/24;B08B5/00;B08B7/00;B23K1/00;B23K1/20;C09J5/02;H01J37/32;(IPC1-7):B32B31/16 |
主分类号 |
H05H1/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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