| 摘要 |
PROBLEM TO BE SOLVED: To easily and securely suppress noise which is easy to generate, specially, between a socket substrate and an inspection substrate as to the constitution of the burn-in board of a semiconductor IC. SOLUTION: This burn-in board is constituted including a socket substrate 22 on which an IC socket 222 is mounted, an inspection substrate 21 which is sized corresponding to multiple socket substrates, and a connector device 23 connecting the socket substrate 22 and inspection substrate 21. The connector device is composed of a plug connector 235 mounted on the socket substrate and a jack connector 231 mounted on the inspection substrate.
|
