| 摘要 |
PROBLEM TO BE SOLVED: To provide an infrared sensor excellent in sensitivity and respondence, having practical mechanical strength. SOLUTION: In this infrared sensor, a temperature sensing element is supported by a support held on a substrate 4, and a hollow part 8 is formed in the substrate 4 under the temperature sensing element. The support is formed from a photosensitive organic thin film 13, and the support supports the temperature sensing element from the upper side. Not only a process for forming the thin film 13 can be simplified and stabilized but also a camber or a damage is hardly generated on the thin film 13, because the organic thin film 13 is soft and has small internal stress.
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