| 摘要 |
PURPOSE: A solder ball and a method for plating the same are provided to prevent discoloration, deformation, oxidation and corrosion by forming a single or multi-layered coating film on surface of a solder ball, and improve qualities of products by uniformly plating on a solder ball having a micro diameter of 0.5 mm or less. CONSTITUTION: A method for plating a solder ball is carried out by putting balls alloyed with lead and tin into a drum (20) of which opening parts having a locking prominence (22) are formed at both sides is installed laterally in a plating vessel (10) containing a plating solution (10A) so that the drum (20) can be rotated in an axis (23) direction, and impressing power source to a negative electrode (31) of a power source part (30) which is formed in a coil spring shape in the drum and a positive electrode (32) which is connected to the plating solution (10A). The negative electrode (31) of the power source comprises a network shape which is formed along a circumferential part inside the drum (20). A diameter of the solder ball is 0.05 to 0.5 mm. A coating film of tin is formed on the surface of the ball alloyed with lead and tin.
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