| 摘要 |
PURPOSE: A semiconductor package and a manufacturing method thereof are provided to realize a thinner and chip-sized package requiring no circuitry substrate. CONSTITUTION: The package(10a) includes a semiconductor chip(2) having a plurality of input/output pads(4) formed on one surface thereof, a plurality of input/output terminals(6) respectively formed on the pads(4), and a protective layer(8) formed on side surfaces and the pad-formed surface of the chip(2) except the terminals(6). The terminals(6) may be formed by conductive balls or tailed balls. The package(10a) is manufactured from a wafer composed of the plural chips(2). The chips(2) in the wafer are separated by scribe lines. The input/output terminals(6) are formed on the respective pads(4) at a wafer level, and then the protective layer(8) is coated on the pad-formed surface of the wafer. The back surface of the wafer may be ground to reduce a thickness of the wafer, and thus to obtain a thinner package. Thereafter, the wafer is completely divided into the separate individual chips(2).
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