发明名称 SYSTEM FOR CONTROLLING THE TEMPERATURE OF A REFLECTIVE SUBSTRATE DURING RAPID HEATING
摘要 A system and process is disclosed for rapidly heating semiconductor wafers coated with a highly reflective material on either the whole wafer or in a patterned area. The wafers are heated in a thermal processing chamber by a plurality of lamps. In order for the wafer coated with the highly reflective material to more rapidly increase in temperature with lower power intensity, a shield member is placed in between the wafer and the plurality of lamps. The shield member is made from a high emissivity material, such as ceramic, that increases in temperature when exposed to light energy. Once heated, the shield member then in turn heats the semiconductor wafer with higher uniformity. In one embodiment, the shield member can also be used to determine the temperature of the wafer as it is heated.
申请公布号 WO0118850(A1) 申请公布日期 2001.03.15
申请号 WO2000IB01222 申请日期 2000.08.30
申请人 STEAG RTP SYSTEMS, INC. 发明人 TAY, SING, PIN;HU, YAO, ZHI;THAKUR, RANDHIR;GAT, ARNON
分类号 H01L21/302;H01L21/00;H01L21/26;H01L21/31;H01L21/316;H01L21/318 主分类号 H01L21/302
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