POLISHING COMPOUND FOR CHEMIMECHANICAL POLISHING AND POLISHING METHOD

摘要

A polishing compound for chemimechanical polishing which comprises an oxidizing agent, an agent for dissolving an oxidized metal, an agent for forming a protective film, a water-soluble polymer and water; and a polishing method using the compound. It is desirable that the water-soluble polymer has a weight average molecular weight of 500 or more, the polishing compound has a coefficient of dynamic friction of 0.25 or more, the polishing compound has an Ubbelohde viscosity of 0.95 to 1.5 cP, and the polishing compound has a pressure at an inflection point of 50 gf/cm<2> or more.