发明名称 PACKAGING ENHANCED BOARD LEVEL OPTO-ELECTRONIC INTERCONNECTS
摘要 A planarized signal communications system (110) embedded within a printed circuit board (102) is disclosed, comprising first (118) and second (120) index buffer layers within the printed circuit board, a polymer waveguide (116) disposed below the first and above the second index buffer layers, an electrical-to-optical transmitter (122) disposed within the first index buffer layer in direct adjoinment with the polymer waveguide, a reflective element (126) disposed within the polymer waveguide in direct alignment with the electrical-to-optical transmitter and adapted to reflect optical energy from the electrical-to-optical transmitter along the polymer waveguide, an optical-to-electrical receiver (124) disposed within the first index buffer layer and in direct adjoinment with the polymer waveguide, a reflective element (126) disposed within the polymer waveguide in direct alignment with the optical-to-electrical receiver.
申请公布号 WO0116630(A1) 申请公布日期 2001.03.08
申请号 WO2000US40726 申请日期 2000.08.24
申请人 BOARD OF REGENTS THE UNIVERSITY OF TEXAS SYSTEM 发明人 CHEN, RAY, T.
分类号 G02B6/12;G02B6/42;G02B6/43;H05K1/02;(IPC1-7):G02B6/12 主分类号 G02B6/12
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