Semiconductor chip mounting apparatus capable of preventing connected portion between semiconductor chip and substrate from thermal stress and method thereof

摘要

In a semiconductor chip mounting apparatus including a mounting section for mounting a semiconductor chip on a substrate, a loader which supplies the substrate to the mounting section, an unloader which contains the substrate having the semiconductor chip mounted thereon into a magazine, the substrate having the semiconductor chip is heated by a heater to be kept at high temperature after the mounting process and until a sealing process for sealing the substrate having the mounted semiconductor chip with a resin.