摘要 |
PROBLEM TO BE SOLVED: To insulate a plurality of electronic parts in a small space and improve the cost and workability of the insulating work by separating the electronic parts from each other by the partition plate sections of a resin case and securing the insulating distances of the parts by the partition plate sections. SOLUTION: A box-like resin case 1 is made of an insulating material, such as the polybutylene terephthalate resin, etc., having low thermal conductivity and has partition plate sections 4 provided in the case 1 for separating adjacent electronic parts 3 from each other. The partition plate sections 4 are integrally formed with the case 1 and the electronic parts 3 are respectively inserted into small room-like spaces separated from each other by the partition plate sections 4. In addition, the terminal sections 3-1 of the parts 3 are inserted into hole sections 2-2 connected to the conductive pattern 2-1 of a printed board 2 and electrically connected to the sections 2-2 by soldering, etc. Thus the high- density packaging of the electronic parts 3 is made possible by securing the insulating distances of the parts 3 by the partition plate sections 4.
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