| 摘要 |
PURPOSE: A method for examining a hole of a printed circuit board is provided to obtain a hole position and size information from CAD data and examine only a necessary part in real time at a high speed. CONSTITUTION: CAD data are analyzed and reference hole data are gathered(ST101-ST102). An image of a PCB which is examined is obtained by using an image acquiring device(ST103). An actual hole is searched in an image obtained in the ST103 with reference to the reference hole data(ST105). A radius of a reference hole obtained from the ST101-ST102 and a radius of an actual hole obtained from the ST105 are compared with each other and whether the actual hole is defective is determined(ST106). Border portions of a circle in diverse directions from the center of the actual hole obtained from the ST105 are examined and whether the actual hole is defective is determined according to a comparison result of the reference hole land width and an actual hole land width(ST107).
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