| 摘要 |
PROBLEM TO BE SOLVED: To form solder bumps having a large volume, even with narrow pitches and provide a wiring board, a semiconductor element and a semiconductor package having high connection reliability. SOLUTION: A jig 10, having through-holes 12 for forming solder bumps at prescribed sites, is placed on the surface of a wiring board or a semiconductor element. A solder paste 27 is filled in the through-holes 12 for forming solder bumps by printing the solder paste 27 via a screen 23 for printing and/or a mask 24 for printing. After solder bumps 34 are formed by melting the filled solder paste, the jig 10 for forming solder bumps is removed from the wiring board or the semiconductor element. |
