| 摘要 |
PROBLEM TO BE SOLVED: To implement wiring to a mounting surface, without increasing the package size by arranging rows of external electrodes by electrically connecting them to a semiconductor chip at unequal intervals in the row directions. SOLUTION: In this semiconductor device, a semiconductor chip 11 is fixed to a base 10, a pad of the chip 11 is connected electrically to wiring of the base 10 via the corresponding bump 12, and an underfill 13 is filled in the gap between the base 10 and the chip 11. The wiring of the base 10, which is electrically connected to the chip 11 for mounting, is connected to external electrodes 2 formed in an array-like manner on the bottom of the base 10, and the electrodes 2 are arranged in rows at unequal intervals along the row direction. Common external electrodes 2a for connection to common wiring are arranged at intervals greater than those of individual external electrodes 2b for connection to individual wiring. The common wiring can be formed over a mounting surface extending between common connection electrodes, which are provided on a board so as to correspond to the electrodes 2a arranged at the greater intervals. |
