| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a circuit board in which the uneven surface of an insulator layer can be prevented, the insulator layer be jointed appropriately, and the reliability be improved. SOLUTION: A distance 30 of a circuit pattern 19 of a conductor layer 21, pinched by an outer insulator layer 22 and an inner insulator layer 23, is made smaller than 30μm. In this case, even if the inner insulator layer 23 is formed by coating, for example, it will not be recessed in the circuit pattern 19, thereby preventing uneveness from forming thereon.</p> |
