发明名称 HEAT SINK FIXING STRUCTURE
摘要 PURPOSE: A heat sink fixing structure is provided to enhance a productivity, cut down a manufacturing cost, and easily attach/detach a heat sink to/from a PCB(Printed Circuit Board). CONSTITUTION: A PCB(1), to which an integrated circuit(2) is mounted, has fixing holes(3). A heat sink(4) is formed with supporting parts(5) which have fixing holes(6) corresponding to the fixing holes(3) of the PCB(1) respectively. In order to fix the heat sink(4) on the integrated circuit(2) mounted to the PCB(1), a fixing member(7) is inserted through the fixing holes(6) of the heat sink(4) and the fixing holes(3) of the PCB(1). The fixing member(7) has a fixing hook(8) at its lower end for preventing the fixing member(7) from separating from the fixing holes(3)(6). A spring(9) for modulating a fastening force of the fixing member(7) is provided around the fixing member(7).
申请公布号 KR20010011519(A) 申请公布日期 2001.02.15
申请号 KR19990030918 申请日期 1999.07.28
申请人 LG ELECTRONICS INC. 发明人 JUNG, GIL SIK
分类号 H05K7/20;(IPC1-7):H05K7/20 主分类号 H05K7/20
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