发明名称 DIE RELEASING MATERIAL
摘要 PROBLEM TO BE SOLVED: To prevent adhesive from projecting into a hole even if it is deep by providing a thermoplastic layer, fluidizing at the time of hot pressing, between upper and lower stripping films and specifying the breaking elongation and 100% elongation of the stripping film on the side touching a laminate under a specified heating temperature. SOLUTION: The die releasing material F comprises a laminar thermoplastic material C, fluidizing at the heating temperature for integrally bonding a multiplayer printed wiring board, sandwiched between upper and lower stripping films A, B. Breaking elongation of the stripping film A under the heating temperature is set at 600% or above and 100% elongation thereof under same temperature is set at 350 gf/cm width or below. When the hot press operation progresses to fuse an adhesive sheet 13, the thermoplastic material C in the die releasing material F fuses to flow smoothly and quickly toward a hole 14 under pressure. Consequently. the hole side stripping film A can adhere to the inner surface of the hole 14 and the adhesive 13 can be prevented surely from projecting without causing any leakage of the fusible thermoplastic material C.
申请公布号 JP2001024105(A) 申请公布日期 2001.01.26
申请号 JP19990199138 申请日期 1999.07.13
申请人 NITTO DENKO CORP 发明人 TACHIBANA TOSHIMITSU;SATO KENJI;IIMURA MITSUO
分类号 H01L21/48;H01L23/13;H01L23/14;H05K3/46 主分类号 H01L21/48
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