| 摘要 |
PROBLEM TO BE SOLVED: To realize high density mounting of high frequency semiconductor devices at low cost by coating the surface of a conduction lead part serving as a conduction line with an insulating resin layer and a conductor layer thereby reducing generation of noise on the signal lead part of a semiconductor device for high frequency signal. SOLUTION: A lead part 4 is coated, on the surface thereof, with an insulating resin layer 6 around each conduction lead part 5 and the insulating resin layer 6 is coated, on the surface thereof, with a conductor layer 7. An inner lead part 4a and an outer lead part 4b have a forward end part formed to expose the signal lead part 5, the insulating resin layer 6 and the conductor layer 7 stepwise. Since the conduction lead part 5 is covered with the conductor layer 7 having a fixed potential through the insulating resin layer 6, generation of crosstalk and radiation of electromagnetic wave can be prevented. Furthermore, the lead part 4 can be formed at fine pitch by controlling the thickness of the insulating resin layer 6 and the conductor layer 7. |
