发明名称 Substrate washing apparatus and method
摘要 The substrate washing apparatus of the present invention comprises a film scrub member permeable to liquid, which is moved relatively to a substrate held substantially horizontally while being in contact with the substrate, a supporting portion for supplying the film scrub member, a supply pipe for supplying a cleaning liquid to the substrate through the film scrub member, cleaning liquid supply means for supplying the cleaning liquid to the supply pipe, pressing means for pressing the film scrub member supplied with the cleaning liquid and swollen, to the substrate, and relative moving means for horizontally moving the film scrub member supplied with the cleaning liquid and swollen, relative to the substrate.
申请公布号 US6175983(B1) 申请公布日期 2001.01.23
申请号 US19980222610 申请日期 1998.12.29
申请人 TOKYO ELECTRON LIMITED 发明人 HIROSE KEIZO;SEKIGUCHI KENJI
分类号 B08B1/04;B08B3/04;B08B3/08;B08B3/12;B08B7/04;H01L21/00;H01L21/304;H01L21/306;(IPC1-7):A47L25/00 主分类号 B08B1/04
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