发明名称 HOT-MELT ADHESIVE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To obtain a hot-melt adhesive capable of reducing a melt viscosity without impairing essential adhesion performances which the hot-melt adhesive has, improving operability, useful for multipurpose uses. SOLUTION: This hot-melt adhesive comprises a resin composition having formed a heat reversible crosslinking bond in a carboxyl group by reacting a polyester resin composed of a structural unit free from a reactive unsaturated bond, containing a carboxyl group or a carboxyl group-containing polyester- based urethane resin with a basic metal compound.
申请公布号 JP2001019931(A) 申请公布日期 2001.01.23
申请号 JP19990191830 申请日期 1999.07.06
申请人 JAPAN U-PICA CO LTD 发明人 KUWABARA MITSURU
分类号 C08G63/91;C08G18/76;C08G18/83;C09J167/02;C09J175/06;(IPC1-7):C09J167/02 主分类号 C08G63/91
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