发明名称 |
Resin composition, process for preparing the same, and laminate containing layer of said resin composition |
摘要 |
A resin composition is provided which comprises (A) a saponified ethylene-vinyl acetate copolymer (referred to as EVOH for short) with an ethylene content of 20 to 60 mole percent and a saponification degree of not less than 90 mole percent, and contains therein (B) a boron compound as an essential component, (C) acetic acid as an optional component, and at least one compound selected from among (D) an acetic acid salt and (E) a phosphoric acid compound as an essential component, the contents of the respective additive components per 100 parts by weight of EVOH (A) being as follows:boron compound (B): 0.001 to 1 part by weight on the boron basis;acetic acid (C): 0 to 0.05 part by weight;acetic acid salt (D): 0.001 to 0.05 part by weight on the metal basis; andphosphoric acid compound (E): 0.0005 to 0.05 part by weight on the phosphate radical basis.This resin composition is typically produced by bringing EVOH (A) with a water content of 20 to 80% by weight into contact with an aqueous solution containing the respective additive components mentioned above and then subjecting the thus-treated EVOH to fluidized state drying and then to stationary state drying.
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申请公布号 |
US6174949(B1) |
申请公布日期 |
2001.01.16 |
申请号 |
US19990269222 |
申请日期 |
1999.03.23 |
申请人 |
NIPPON GOHSEI KAGAKU KOGYO KABUSHIKI KAISHA |
发明人 |
NINOMIYA KENJI;KUNIEDA MAKOTO |
分类号 |
B32B27/32;C08K3/38;(IPC1-7):C08K3/38 |
主分类号 |
B32B27/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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