发明名称 |
WAFER-PAIR HAVING CHAMBERS SEALED WITH A DEPOSITED LAYER AND METHOD FOR FORMING WAFER-PAIR |
摘要 |
A wafer-pair having at least one recess in one wafer and the recess formed into a chamber with the attaching of the other wafer which has a port plugged with a deposited layer on its external surface. The deposition of the layer may be performed in a very low pressure environment, thus assuring the same kind of environment in the sealed chamber. The chamber may enclose at least one device such as a thermoelectric sensor, bolometer, emitter or other kind of device. The wafer-pair typically will have numerous chambers, and may be divided into chips. |
申请公布号 |
EP1068638(A1) |
申请公布日期 |
2001.01.17 |
申请号 |
EP19990918445 |
申请日期 |
1999.03.29 |
申请人 |
HONEYWELL INC. |
发明人 |
WOOD, R., ANDREW;RIDLEY, JEFFREY, A.;HIGASHI, ROBERT, E. |
分类号 |
B81B7/00;H01L29/84;H01L23/02;H01L25/16;(IPC1-7):H01L23/10 |
主分类号 |
B81B7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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