MICRO-SENSOR AND METHOD FOR PACKAGING THE SAME

摘要

PURPOSE: A micro-sensor and method for packaging the same are provided to be capable of effectively connecting the internal of a packaged micro-sensor and the surface of a wafer without short during the process by means of wafer bonding. CONSTITUTION: A micro-sensor packaging method includes etching the surface of a wafer to a ceratin thickness so that the structure can be mounted on the surface of the wafer. A sacrificial layer is then formed on the bottom of the etch section. After a cavity is formed in the wafer for additional package, a package wafer(140) is mounted by means of bonding process from the surface of the device. Next, a connection hole(160) for connecting the surface of the device wafer and a metal electrode pattern(220) to be formed on the surface of the package wafer. Thereafter, a metal(170) is deposited into the connection hole formed in the package wafer and a patterning process is then performed.