| 摘要 |
PROBLEM TO BE SOLVED: To impart a film forming capability by providing a specified low dielectric resin composition layer on one or both sides of a peeling film or a metal layer thereby enhancing adhesion to metal with low permittivity and low dielectric loss tangent. SOLUTION: A low dielectric resin composition layer containing at least one polyimide comprising 100-40 mol.% of at least one kind of structural unit represented by formula Ia and 0-60 mol.% of at least one kind of structural unit represented by formula Ib, and at least one kind selected from compounds represented by formula II or III is provided on one or both sides of a peeling film or a metal layer. In the formula, Ar is a bivalent group having an aromatic ring, R is -CH2OC6H4- where an alkylene or methylene group of 1-10C is bonded to Si, n is an integer of 1-20, R1-R4 is a hydrogen atom, an alkyl or alkoxyl group of 1-4C, and R5-R7 further includes a chlorine atom, a bromine atom, and a carboxyl group. |
