| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a wiring board in which conduction in a wiring conductor layer, etc., is assured by forming a through hole conductor layer of high density and effectively preventing peeling and blister, etc., in an insulating substrate. SOLUTION: A specified region of a photosensitive ceramic green sheet 1 is irradiated with light to form a photocuring ceramic sheet 1a provided with through holes 3 and an auxiliary photocuring ceramic sheet 1b provided with through holes 4a of a given pattern, and then the auxiliary photocuring ceramic sheet 1b is laminated on the lower surface of the photocuring ceramic sheet 1a to form a laminated photocuring ceramic sheet 1c provided with groove parts 4 of a predetermined pattern on the lower surface thereof. Then a conductor layer 5 for wiring and a conductor layer 6 for through hole are formed on the upper surface of the laminated photocuring ceramic sheet 1c and in the through hole 3, respective, and then a plurality of laminated photocuring ceramic sheets 1c are stacked so that the conductor layer 5 for wiring fits with the groove part 4 and they are baked. |
