| 摘要 |
A semiconductor device comprising a tab (5) supporting a semiconductor chip (8), a sealing part (12) formed by encapsulating the semiconductor chip (8) with resin, tab suspension leads (4) supporting the tab (5), a plurality of leads (2) having parts to be connected and exposed in the periphery of the back of the sealing part (12), and thin parts thinner than the parts to be connected and provided in the edge area of the tab side, and each having an inner dent (2e) and an outer dent (2f) in the wire bonding face (2d) arranged in each of the parts to be connected in the inside of the sealing part (12), wires (10) connecting the pads (7) of the semiconductor chip (8) to the leads (2), wherein the thin parts of the leads (2) are covered with the resin for the sealing, the wires (10) are connected to the parts to be connected respectively at positions between the outer dents (2f) and the inner dents (2e), and the outer dents (2f) and the inner dents (2e) in the thin parts of the leads (2) serve to prevent the leads from coming off. |
