发明名称 Resin seal package and terminal forming board
摘要 A resin seal package (60) which comprises a metal film (15), and a sealing resin (10) cured as it is left contacted with the metal film (15), wherein the package terminal shape is such that the metal film (15) formed on the terminal surface will not come off the sealing resin (10). Further, a package is in the form of a terminal forming board (30) having a metal film (15) transferred onto the sealing resin (10), characterized in that the forming board is a multi-layer metal board (50) composed of two metal layers. Further, this package is such that the multi-layer metal board (50) is formed of layers different in the degree to which they are corroded by acid or alkali etching. And at least one layer of the terminal forming board (30) is etched more progressively in the transverse direction than the other layers and the sealing resin (10) filled in holes is so formed as to act as an anchor on the more progressively etched portion.
申请公布号 AU5566900(A) 申请公布日期 2001.01.09
申请号 AU20000055669 申请日期 2000.06.21
申请人 TOYO KOHAN CO. LTD.;NOGE ELECTRIC INDUSTRIES CO., LTD. 发明人 YASUSHI UMEDA;KINJI SAIJO;SHINJI OHSAWA
分类号 H01L21/48;H01L23/31 主分类号 H01L21/48
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