| 摘要 |
The invention relates to a device for integrally joining a metal block (11') that can consist of a number of plates, by hard-soldering. The hard-solder provides a connection covering a large surface and with a minimal thickness in solder gaps (17j; j = 1, 2, n-1) located between adjacent segment plates (12i; i = 1, 2, ...n). At least one capillary solder inflow path (14) is provided. Said solder inflow path starts at a solder depot containing a supply of hard solder material (42), which melts as the stack (11) of plates is heated. The melted solder material flows directly to the individual, also capillary solder gaps (17j; j = 1, 2, ..., n-1) via said solder inflow path, the solder gaps being provided between surfaces of the segment plates (12i) that face towards each other. |
