INTEGRATED CIRCUIT PACKAGE, MILLIMETER WAVE INTEGRATED CIRCUIT PACKAGE, AND METHOD OF ASSEMBLING AND MOUNTING INTEGRATED CIRCUIT PACKAGE ON BOARD

摘要

PROBLEM TO BE SOLVED: To obtain a millimeter-wave IC package, which is mounted on the surface of a printed circuit board, high in heat dissipation efficiency, and capable of efficiently coupling energy that is inputted in or outputted from its package structure. SOLUTION: An IC package 10 is equipped with a multilayer interconnector 16, possessed of a dielectric layer 32 located between a base layer 34 and a transmission conductive layer 36, the conductive layer 36 can be electrically connected to a board 11 and is electrically connected to an IC 18. An IC package 10 is equipped with a base material 12, which is engaged with the base layer 34 of the multilayer interconnector 16.